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  march 2011 doc id 018562 rev 1 1/7 7 STPS3L40-Y automotive power schottky rectifier features negligible switching losses low thermal resistance low forward voltage drop avalanche capability specified ecopack ? 2 compliant component aec-q101 qualified description schottky rectifier suited for switched mode power supplies and high frequency dc to dc converters. packaged in smc, this device is intended for use in dc/dc chargers for automotive application. table 1. device summary symbol value i f(av) 3 a v rrm 40 v t j (max) 150 c v f (max) 0.44 v k a smc stps3l40sy www.st.com
characteristics STPS3L40-Y 2/7 doc id 018562 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.30 x i f(av) + 0.047 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(av) average forward current t l = 120 c = 0.5 3 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 75 a p arm repetitive peak avalanche power t p = 1 s tj = 25 c 1300 w t stg storage temperature range -65 to + 175 c t j operating junction temperature range (1) 1. condition to avoid thermal r unaway for a diode on its own heatsink -40 to +150 c table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead 18 c/w table 4. static electrical characteristics symbol parameter test conditions typ. max. unit i r (1) 1. pulse test: tp = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 125 c 16 40 ma v f (1) forward voltage drop t j = 25 c i f = 3 a 0.5 v t j = 125 c 0.40 0.44 t j = 25 c i f = 6 a 0.62 t j = 125 c 0.52 0.58 dptot dtj < 1 rth(j-a)
STPS3L40-Y characteristics doc id 018562 rev 1 3/7 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) - smc 0.0 0.4 0.8 1.2 1.6 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 p (w) f(av) t =tp/t tp i (a) f(av) = 1 = 0.05 = 0.1 = 0.2 = 0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 i (a) f(av) t (c) amb r =75c/w th(j-a) r=r th(j-a) th(j-l) smc t =tp/t tp figure 3. non repetitive surge peak forward current versus overload duration (maximum values) figure 4. normalized avalanche power derating versus pulse duration 0 2 4 6 8 10 12 14 1.e-03 1.e-02 1.e-01 1.e+00 i m t =0.5 i (a) m t(s) t =25c a t =75c a t =125c a smc 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm figure 5. normalized avalanche power derating versus junction temperature figure 6. relative variation of thermal impedance junction to ambient versus pulse duration 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25c) arm arm 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-c) th(j-c) t =tp/t tp t (s) p single pulse smc
characteristics STPS3L40-Y 4/7 doc id 018562 rev 1 figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) figure 9. forward voltage drop versus forward current figure 10. thermal resistance junction to ambient versus copper surface under each lead 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 i (ma) r v (v) r t =125c j t =100c j t =25c j 10 100 1000 110100 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j i (a) fm 0.01 0.10 1.00 10.00 100.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t j =25c (maximum values) t j =125 c (typical values) t j =125 c (typical values) t j =125 c (maximum values) t j =125 c (maximum values) v (v) fm 0 10 20 30 40 50 60 70 80 90 100 110 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s (cm2) cu r (c/w) th(j-a) epoxy printed board fr4, copper thickness = 35 m
STPS3L40-Y package information doc id 018562 rev 1 5/7 2 package information epoxy meets ul94,v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. smc footprint dimensions in mm (inches) table 5. smc package dimensions ref dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.40 0.030 0.063 e c l e2 e1 d a1 a2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14
ordering information STPS3L40-Y 6/7 doc id 018562 rev 1 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode stps3l40sy s3l4y smc 0.24 g 2500 tape and reel table 7. document revision history date revision changes 10-mar-2011 1 first issue.
STPS3L40-Y doc id 018562 rev 1 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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